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Dimensions: 6.6×6.4×3.1mm
Inductance Range: 0.065~18μH (±20%)
• Lowest DCR, ultra-low AC loss across wide frequency band
• Excellent current-handling capability, soft saturation characteristics
Core Material: Composite magnetic powder core
Environmental Rating: RoHS compliant, Halogen-free
Terminal Plating: Ni-Sn (customizable SAC/SP)
Anti-rust Treatment: Terminal anti-rust plating
Operating Temperature: -40℃ ~ +125℃
Max. Component Temperature: +165℃ (ambient + temp rise)
Storage Temperature: -55℃~+165℃ (bulk); -55~+80℃ (reel)
Reflow Soldering: Max. 3 cycles, 260℃/40s
MSL Rating: Level 1, unlimited floor life
Rated Voltage: 80V

Specifications

No.Part NumberInductance ±20% (μH)DCR typ (mΩ)DCR max (mΩ)SRF typ (MHz)Isat (A)10%-30%Irms 20℃ rise (A)Irms 40℃ rise (A)
1SYP6030-650MSN0.0650.530.6340026.0 / 42.0 / 57.530.543
2SYP6030-181MSN0.1811.214017.5 / 29.5 / 43.025.334.7
3SYP6030-221MSN0.221.21.513016.5 / 27.5 / 39.02332
4SYP6030-381MSN0.3822.47212.5 / 20.5 / 29.019.828
5SYP6030-471MSN0.472.22.76611.5 / 18.7 / 26.518.125
6SYP6030-681MSN0.682.93.5529.2 / 15.3 / 22.015.822.5
7SYP6030-821MSN0.823.44509.1 / 14.9 / 21.014.921
8SYP6030-102MSN14.24.9427.5 / 12.4 / 17.71318.1
9SYP6030-122MSN1.24.65.4427.4 / 12.3 / 17.31216.5
10SYP6030-152MSN1.56.27.3356.3 / 10.3 / 14.510.415
11SYP6030-182MSN1.87.58.9335.9 / 9.4 / 14.59.514.5
12SYP6030-222MSN2.28.710.3285.4 / 8.7 / 12.28.512
13SYP6030-332MSN3.313.115.4254.6 / 7.5 / 10.47.610.5
14SYP6030-472MSN4.717.521193.8 / 6.1 / 8.67.210
15SYP6030-562MSN5.620.524.1183.5 / 5.9 / 8.26.58.8
16SYP6030-682MSN6.825.129.5163.2 / 5.2 / 7.368.2
17SYP6030-822MSN8.23540142.8 / 4.6 / 6.55.17.1
18SYP6030-103MSN103844132.7 / 4.4 / 6.257
19SYP6030-123MSN124653122.4 / 3.9 / 5.54.46
20SYP6030-153MSN1562.172102.1 / 3.4 / 4.63.95.2
21SYP6030-183MSN1869.6809.51.9 / 3.1 / 4.43.44.7
  1. Inductance: 1MHz, 0.1Vrms, 0Adc test condition, Ta=25℃.

  2. DCR: DC micro-ohmmeter measurement.

  3. SRF: High-precision network analyzer test.

  4. Isat: DC current at which inductance drops by specified percentage at 25℃; derating required for high-temperature applications.

  5. Irms: DC current causing specified temperature rise (20℃/40℃); for reference only, actual verification required in end-system testing.

  6. Terminal Code: SN=Sn-Ni, SAC=Sn-Ag-Cu; SP=Sn-Pb (non-RoHS).

  7. Packaging: Tape & reel, complies with EIA-481 standards; supports 7-inch / 13-inch reels.

  8. Electrical Test Conditions: Ta=25℃, specifications subject to change without notice.


Features

· Lowest DC resistance with significantly reduced AC losses, outstanding performance at high frequencies

· Higher inductance in the same PCB footprint; smaller footprint for the same inductance, ideal for high-density layouts

· Substantially enhanced Irms (temp rise current) and Isat (saturation current), resulting in lower heat generation and higher efficiency



Applications

· Servers, PC motherboard VRM/VRD, CPU core power delivery (Core Application)

· High-density high-current power modules, high-performance FPGA/SoC power stages

· Industrial high-power systems requiring high efficiency and low temperature rise

· Automotive electronics and telecom equipment with strict dimensional constraints

SYP2DDimension Drawing6030_01.png

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