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Dimensions: 6.6×6.4×6.1mm
Inductance Range: 0.22~47μH (±20%)
• Lowest DCR, ultra-low AC loss across wide frequency band
• Excellent current-handling capability, soft saturation characteristics
• Wide inductance range up to 47µH
Core Material: Composite magnetic powder core
Environmental Rating: RoHS compliant, Halogen-free
Terminal Plating: Ni-Sn (customizable SAC/SP)
Anti-rust Treatment: Terminal anti-rust plating
Operating Temperature: -40℃ ~ +125℃
Max. Component Temperature: +165℃ (ambient + temp rise)
Storage Temperature: -55℃~+165℃ (bulk); -55~+80℃ (reel)
Reflow Soldering: Max. 3 cycles, 260℃/40s
MSL Rating: Level 1, unlimited floor life
Rated Voltage: 80V

Specifications

No.Part NumberInductance ±20% (μH)DCR typ (mΩ)DCR max (mΩ)SRF typ (MHz)Isat (A)10%-30%Irms 20℃ rise (A)Irms 40℃ rise (A)
1SYP6060-221MSN0.221.11.312517.8 / 28.5 / 38.035.548
2SYP6060-471MSN0.471.51.87513.8 / 22.0 / 29.52635.5
3SYP6060-681MSN0.6822.36012.5 / 19.6 / 26.523.532
4SYP6060-102MSN12.52.94611.0 / 17.2 / 23.020.528
5SYP6060-122MSN1.22.93.4419.8 / 15.1 / 20.51926.5
6SYP6060-152MSN1.53.33.8418.9 / 13.8 / 18.31926
7SYP6060-182MSN1.83.84.3358.4 / 12.8 / 16.917.523.5
8SYP6060-222MSN2.24.34.8307.9 / 12.1 / 16.015.220.7
9SYP6060-332MSN3.35.96.5246.6 / 10.1 / 13.412.517.2
10SYP6060-472MSN4.79.110.1195.1 / 7.8 / 10.210.514.3
11SYP6060-562MSN5.610.611.7174.8 / 7.3 / 9.69.512.7
12SYP6060-682MSN6.812.714164.5 / 6.8 / 8.98.511.5
13SYP6060-822MSN8.215.216.8144.1 / 6.2 / 8.1811
14SYP6060-103MSN1018.520.4143.6 / 5.5 / 7.37.310
15SYP6060-123MSN122224.2133.4 / 5.1 / 6.76.99.4
16SYP6060-153MSN1528.231.1112.9 / 4.4 / 5.85.77.8
17SYP6060-183MSN1833.937.3102.8 / 4.2 / 5.55.27.0 
18SYP6060-223MSN2242.646.992.5 / 3.9 / 5.14.56.2
19SYP6060-333MSN3363.169.572.0 / 3.1 / 4.03.64.9
20SYP6060-473MSN479710761.6 / 2.5 / 3.22.73.7
  1. Inductance: 1MHz, 0.1Vrms, 0Adc test condition, Ta=25℃.

  2. DCR: DC micro-ohmmeter measurement.

  3. SRF: High-precision network analyzer test.

  4. Isat: DC current at which inductance drops by specified percentage at 25℃; derating required for high-temperature applications.

  5. Irms: DC current causing specified temperature rise (20℃/40℃); for reference only, actual verification required in end-system testing.

  6. Terminal Code: SN=Sn-Ni, SAC=Sn-Ag-Cu; SP=Sn-Pb (non-RoHS).

  7. Packaging: Tape & reel, complies with EIA-481 standards; supports 7-inch / 13-inch reels.

  8. Electrical Test Conditions: Ta=25℃, specifications subject to change without notice.


Features

· Lowest DC resistance with significantly reduced AC losses, outstanding performance at high frequencies

· Higher inductance in the same PCB footprint; smaller footprint for the same inductance, ideal for high-density layouts

· Substantially enhanced Irms (temp rise current) and Isat (saturation current), resulting in lower heat generation and higher efficiency



Applications

· Servers, PC motherboard VRM/VRD, CPU core power delivery (Core Application)

· High-density high-current power modules, high-performance FPGA/SoC power stages

· Industrial high-power systems requiring high efficiency and low temperature rise

· Automotive electronics and telecom equipment with strict dimensional constraints

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