Features
· Lowest DC resistance with significantly reduced AC losses, outstanding performance at high frequencies
· Higher inductance in the same PCB footprint; smaller footprint for the same inductance, ideal for high-density layouts
· Substantially enhanced Irms (temp rise current) and Isat (saturation current), resulting in lower heat generation and higher efficiency
Applications
· Servers, PC motherboard VRM/VRD, CPU core power delivery (Core Application)
· High-density high-current power modules, high-performance FPGA/SoC power stages
· Industrial high-power systems requiring high efficiency and low temperature rise
· Automotive electronics and telecom equipment with strict dimensional constraints