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Dimensions: 5.48×5.28×5.1mm
Inductance Range: 0.16~33μH (±20%)
• Lowest DCR, ultra-low AC loss across wide frequency band
• Excellent current-handling capability, soft saturation characteristics
• Inductance range 0.16~33µH
Core Material: Composite magnetic powder core
Environmental Rating: RoHS compliant, Halogen-free
Terminal Plating: Ni-Sn (customizable SAC/SP)
Anti-rust Treatment: Terminal anti-rust plating
Operating Temperature: -40℃ ~ +125℃
Max. Component Temperature: +165℃ (ambient + temp rise)
Storage Temperature: -55℃~+165℃ (bulk); -55~+80℃ (reel)
Reflow Soldering: Max. 3 cycles, 260℃/40s
MSL Rating: Level 1, unlimited floor life
Rated Voltage: 80V

Specifications

No.Part NumberInductance ±20% (μH)DCR typ (mΩ)DCR max (mΩ)SRF typ (MHz)Isat (A)10%-30%Irms 20℃ rise (A)Irms 40℃ rise (A)
1SYP5050-161MSN0.161.21.515514.9 / 23.5 / 32.020.526
2SYP5050-331MSN0.331.6210010.7 / 16.9 / 23.51924.6
3SYP5050-501MSN0.52.22.7909.2 / 14.1 / 19.017.824.2
4SYP5050-561MSN0.562.53888.5 / 13.2 / 18.017.624
5SYP5050-721MSN0.722.73.3708.2 / 12.5 / 16.817.223.5
6SYP5050-821MSN0.822.93.5707.6 / 11.6 / 15.516.622.9
7SYP5050-102MSN13.23.9607.5 / 11.5 / 15.415.721
8SYP5050-122MSN1.23.84.6507.4 / 11.2 / 15.114.820.1
9SYP5050-152MSN1.54.75.7456.5 / 9.8 / 13.112.817.1
10SYP5050-182MSN1.86.57.8405.5 / 8.3 / 11.111.115.3
11SYP5050-222MSN2.26.88.2375.3 / 8.0 / 10.710.213.8
12SYP5050-282MSN2.88.59.8334.8 / 7.3 / 9.89.112.4
13SYP5050-332MSN3.31011.5304.3 / 6.4 / 8.68.111.3
14SYP5050-472MSN4.713.916253.5 / 5.3 / 7.07.19.7
15SYP5050-562MSN5.617.919.7223.2 / 4.8 / 6.45.88
16SYP5050-682MSN6.82123.1213.0 / 4.6 / 6.25.57.5
17SYP5050-822MSN8.224.927.5182.7 / 4.1 / 5.55.27
18SYP5050-103MSN1030.533.6172.5 / 3.7 / 4.94.66.2
19SYP5050-123MSN1239.143152.2 / 3.3 / 4.33.85.1
20SYP5050-153MSN1549.854.9132.0 / 2.9 / 3.93.44.6
21SYP5050-183MSN1856.562.5121.8 / 2.8 / 3.73.34.5
22SYP5050-223MSN2272.179.5111.6 / 2.5 / 3.334
23SYP5050-333MSN3310711881.3 / 1.9 / 2.52.43.2
  1. Inductance: 1MHz, 0.1Vrms, 0Adc test condition, Ta=25℃.

  2. DCR: DC micro-ohmmeter measurement.

  3. SRF: High-precision network analyzer test.

  4. Isat: DC current at which inductance drops by specified percentage at 25℃; derating required for high-temperature applications.

  5. Irms: DC current causing specified temperature rise (20℃/40℃); for reference only, actual verification required in end-system testing.

  6. Terminal Code: SN=Sn-Ni, SAC=Sn-Ag-Cu; SP=Sn-Pb (non-RoHS).

  7. Packaging: Tape & reel, complies with EIA-481 standards; supports 7-inch / 13-inch reels.

  8. Electrical Test Conditions: Ta=25℃, specifications subject to change without notice.


Features

· Lowest DC resistance with significantly reduced AC losses, outstanding performance at high frequencies

· Higher inductance in the same PCB footprint; smaller footprint for the same inductance, ideal for high-density layouts

· Substantially enhanced Irms (temp rise current) and Isat (saturation current), resulting in lower heat generation and higher efficiency



Applications

· Servers, PC motherboard VRM/VRD, CPU core power delivery (Core Application)

· High-density high-current power modules, high-performance FPGA/SoC power stages

· Industrial high-power systems requiring high efficiency and low temperature rise

· Automotive electronics and telecom equipment with strict dimensional constraints

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