AI servers (e.g., multiphase power supplies for GPUs/CPUs) face core challenges: ultra-high currents, extremely fast transient load jumps, and highly constrained board space. Hot-pressed molded inductors perfectly meet these stringent requirements.
First, AI chips switch rapidly between full load and idle states, requiring excellent transient anti-saturation capabilities. Hot-pressed inductors typically utilize an "independent magnetic core + distributed air gap" structure. During sudden high-current surges, the inductance exhibits a smooth "soft-saturation" drop. This effectively prevents loop instability or catastrophic failure caused by the abrupt saturation of traditional inductors.
Second, to reduce copper loss under high currents, the hot-pressing process allows for thicker flat copper wire to be wound within a limited volume, achieving ultra-low DC resistance (DCR) and significantly improving power conversion efficiency.
Furthermore, the hot-pressing process generates minimal internal stress, preventing damage to the winding insulation. This ensures long-term reliability under 7×24 high-load server operations. Additionally, its fully shielded, compact structure effectively reduces EMI interference, empowering engineers to achieve high-density power layout designs.